| Message: | Electronic SMT PCB Assembly at MOKOMOKO has
been offering surface mount (SMT) assembly services for more than 10
years. Using a team of seasoned manufacturing engineers and associates, MOKO has established a name for itself in the contract electronics
manufacturing industry as a leader in SMT printed circuit board (PCB)
assembly solutions.Electronic SMT PCB Assembly Capabilities We
have the capabilities to assemble SMT prototype PCBs in small
production runs with manual and/or automated SMT production processes,
including single- or double-sided component insertions.Our production facilities can assemble the following SMT types:Ball Grid Array (BGA)Ultra-Fine Ball Grid Array (uBGA)Quad Flat Pack No-Lead (QFN)Quad Flat Package (QFP)Small Outline Integrated Circuit (SOIC)Plastic Leaded Chip Carrier (PLCC)Package-On-Package (PoP)Small Chip Packages (pitch of 0.2 mm)We are also capable of through-hole parts. For passive components, our
equipment can work with chips as small as ultra-small 0201 series.DFM: Matching The Design to the Assembly ProcessUsing our Design for Manufacturing (DFM) service, we begin the
manufacturing process by first reviewing your SMT assembly design to
develop the most appropriate manufacturing process, including the
soldering process where we abide by the customer’s specifications for
reflow SMT soldering for each part. Our reviews are only advisory, and
final decisions always reside with the customer. Due to our extremely
precise control system, we can generate very high yield rates.X-Ray InspectionsWe use X-ray inspection equipment to ensure high-quality solder joints.
Many problems with SMT soldering can be discovered by utilizing 3D X-ray
inspection equipment, and this is critical for BGA assembly orders.
X-ray inspections are crucial for lead-less components such as BGAs,
DFNs and QFNs, since there is no direct visual inspection method
available for these components.Cost Reductions and ConvenienceOur DFM advisory service detects......url:http://www.protelpcbs.com |
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