| Message: | 1. Gold 4N bonding wireFor the outstanding chemical and mechanical properties, pure gold bonding wire is a ideal material connecting chip to substrate, is one of the key materials in semiconductor encapsulation industry. Over 13 years experience, strict and standard production procedure, 100 class purification workshop, Gpilot guarantees the quality to every one of our customers!2. Mechanical Properties3. Download certificategold wire-2014REACH.PDFgold wire-EU SDS.pdfgold wire-ROSH.PDFSb_pfoa_PFOS.PDF url:http://www.gpilot-bondingwire.com |
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