| Message: | Epoxy resin curing agent 4, 4'-Diaminodiphenylsulfone (DDS)
English name: 4, 4'-Diaminodiphenylsulfone (DDS)
Other name: 4, 4'-Diaminodiphenyl sulfone; Dapsonum; Bis(4-aminophenyl)sulfone
Molecular Formula: C12H12N2O2S
Molecular Weight: 248.30
CAS No.: 80-08-0
EINECS No.: 201-248-4
Identification:
Chemical name: 4,4 '- diaminodiphenyl sulfone
Other names: dapsone; 4 - aminophenyl sulfone; diamino diphenyl sulfone; 4,4 '- diamino diphenyl sulfone
CAS Number: 80-08-0
Chemical Description:
Molecular formula: C12H12N2O2S
Molecular Weight: 248.30
Structure:
Description and Physical Properties:
Physical state: Solid (powder)
Solubility: soluble in methanol, ethanol, acetone and hydrochloric acid, insoluble in water
Quality Index:
Appearance: white crystal powder
Assay: 99.5% min.
Melting point: 175.0 ° C-181.0 ° C
Loss on drying: 0.2% max. (Enterprise standard)
Packing:25 kg / drum.
Uses:
1.synthetic polysulfone amide resin and other polymers.
2. Epoxy resin curing agent
3. Adhesive
4. gas chromatography stationary phase
5. anti-leprosy drugs
Mainly related to the above purposes aerospace industry, industrial laminates, insulation materials, textile equipment, pharmaceutical and other industries.
Handling and Storage:
Wash thoroughly after handling body. Remove contaminated clothing and wash before re-use. Avoid contact with eyes, skin and clothing, ingestion and inhalation.
Store in a cool, dry place. In Keep container closed when not in use.
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