| Message: | Electroformed Hub Dicing Blade
Electroformed Hub Dicing Blade Is Made By Using An Ultra-Thin Diamond Wheel And A High Precision Aluminum Alloy Hub.
Applications Of Hub Dicing Blade:
Cutting Silicon Wafers, Copper Wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass
The Features Of Hub Type Dicing Blade:
* Improving Balance Between Blade Life And Processing Quality (In Particular Backside Chipping)
* Strengthens Rigidity, Reduction In Wavy Cutting And Blade Wear Under High Load Conditions
* Precise Control Of Diamond Grit Size, Diamond Concentration, And Nickel Bond Hardness To Reduce Splitting On The Edges
* Realizes High Speed Wafer Cutting After Laser Grooving.
The Specification Of Hub Type Dicing Blade:
Exposure(Μm) 380 510 640 760 890 1020 1150 1270 Grit Size
Kerf Width(Μm) 380 - 510 510 - 640 640 - 760 760 - 890 890 - 1020 1020 - 1150 1150 - 1270 1270 - 1400 #5000
#4800
#4500
#4000
#3500
#3000
#2500
#2000
#1800
#1700
#1500
16 - 20 20 * 380 20 * 510
21 - 25 25 * 380 25 * 510 25 * 640
26 - 30 30 * 380 30 * 510 30 * 640 30 * 760 30 * 890 20 * 1020
31 - 35 35 * 380 35 * 510 35 * 640 35 * 760 35 * 890 35 * 1020
36 - 40 40 * 380 40 * 510 40 * 640 40 * 760 40 * 890 40 * 1020 40 * 1150
41 - 50 50 * 380 50 * 510 50 * 640 50 * 760 50 * 890 50 * 1020 50 * 1150 50 * 1270
51 - 60 60 * 510 60 * 640 60 * 760 60 * 890 60 * 1020 60 * 1150 60 * 1270
61 - 70 70 * 640 70 * 760 70 * 890 70 * 1020 70 * 1150 70 * 1270
71 - 80 80 * 890 80 * 1020 80 * 1150 80 * 1270
81 - 90 90 * 1020 90 * 1150 90 * 1270
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Anna.wang@moresuperhard.com
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