| Message: | China Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer
Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.
Coolant: Oil, emulsion
workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt
Material of workpiece: monocrystalline silicon and some other semiconductor materials.
Specifications
1.be used with Japanese, German, American, Korea and Chinese grinders
2.superior grinding performance
3.high cost performance
Shape code Profile Sketch Conventional Specification (mm)
Out diameter D Thickness
T Hole diameter H
6A2 175 30, 35 76
200 35 76
375 40 127
6A2T 195 22.5, 25 170
280 30 228.6
350 35 235
6A2T- 209 22.5 158
Application: back thinning, grinding and fine grinding.
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDMIf you need any products, do not hesitate to contact
Annamoresupe@gmail.com
Anna.wang@moresuperhard.com
WhatsApp:+8615617785923
Skype:Annawng
Wechat:15617785923
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Mobile:+86-156177854923
Tel/Fax:+86-0371-86545906 |
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