| Message: | Resin bond diamond grinding wheel
Resin bond diamond grinding wheel is mainly used for surface grinding, cylindrical grinding of tungsten carbide gages, tungsten steel, high speed steel, alloy steel, glass, gemstones, magnetic materials, ceramics, molds, etc. Applications Of Resin Diamond Grinding Wheel
Resin bond diamond grinding wheel can be used as plunge grinding and forming. Grinding Because of the characteristics of diamond abrasives (high hardness, high compressive strength, and good wear resistance), it is an ideal tool for grinding hard and brittle materials and hard alloys in grinding. It is not only efficient, but also High precision, good roughness, low abrasive consumption, long service life, and improved working conditions.
Therefore, it is widely used for low iron content metal and non-metallic hard brittle materials such as hard alloys, high-aluminum ceramics, optical glass, agate gemstones, and semiconductor materials that are difficult to process with ordinary abrasive tools.
Specifications Of Resin bond diamond grinding wheel
Model D (Mm) T (Mm) H (Mm) X (Mm) U (Mm)
1A1 80 10 32 8, 10
150 10 32 10
155 10 32 10
160 10 32 10,12
170 10 32 10, 12, 14
175 10 32 10
220 10 32 20
14A1 170 10 32 10, 12, 14 5
175 10 32 10, 15 5
Grain Size :MD20, MD40, MD60, MD80
MD-20: Fine Polishing,Perfect Shining Performance And Long Life For Polishing Small Diamond (10 Points- 1carat)
MD-40, MD-60: Rough Polishing,High Efficiency Polishing And Sharp Cutting For Big Diamond.(1ct ,1.2ct And 1.3 Carat,Etc)
MD-80: Rougher Polishing, Higher Efficiency And Sharp Cutting For Bigger Stones.(2 Carat And 3 Carat,Etc)
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