| Message: | Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer
Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.
Coolant: Oil, emulsion
workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt
Material of workpiece: monocrystalline silicon and some other semiconductor materials.
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM
Main role of back grinding wheel
In the middle of the pre-production process, thick silicon wafer can reduce damage; before assembly, silicon wafer is thinned, which is conducive to heat dissipation; reduce package volume; improve mechanical strength (softer after thinning, softer after thinning, minus Small stress); improve electrical performance (short connection); reduce the workload of dicing wafer
Vitrified bond suitable for silicon wafer back grinding wheel
Vitrified bond diamond grinding wheel bond agent has higher strength; good wear resistance, sharp cutting Grinding efficiency is high, and easy to trim; generally suitable for silicon wafers, such as rough grinding, semi-finishing grinding, etc.
The diamond grinding wheel has good self-sharpening performance and is not easy to clog; the grinding efficiency is high, the grinding force is small, and the grinding temperature is low The bonding agent itself has good elasticity and polishing performance; the workpiece has high surface finish and good surface quality; it is suitable for fine grinding and polishing of silicon wafers.
If you need any products, do not hesitate to contact
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Anna.wang@moresuperhard.com
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