| Message: | For wafer scribing and dicing, you need the sharp edge of the RFH UV laser
Website: http://www.rfhtech.com
Whatsapp(Wechat): 18928466502
Email: export06@rfhlasertech.com
Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing.
Return visit: RFH UV laser scribing on the wafer, what's the customer's comment
RFH has recently welcomed a number of return visits from customers. Among them, Mr. Chen has been ordering cooperation with RFH for five years. He is the first batch of manufacturers to use UV lasers for wafer scribing. At that time, UV lasers were not widely used, and after RFH tried to scribe the wafer surface, Mr. Chen immediately chose to visit and witness the possibility of wafer scribing.
Standing in the wave of laser technology, RFH UV lasers win customers’ hearts with their strengths
For him, the traditional process of scribing the wafer surface has insufficient precision, slow speed, and many consumables that have plagued him for a long time. During the visit of RFH, he witnessed the spot emitted by the RFH UV laser continuously moving on the tiny wafer. It only took more than ten seconds to complete the complex scribing, and it was able to automatically complete the scribing without the involvement of employees. conduct.
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